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المنزل > المنتجات > pcb depaneling آلة > Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly

تفاصيل المنتج

مكان المنشأ: جيانغسو، الصين

اسم العلامة التجارية: YUSH

شروط الدفع والشحن

الحد الأدنى لكمية: 1 مجموعة

الأسعار: $8,000 / set

احصل على أفضل سعر
إبراز:

Pulse-heated soldering machine for FPC,High-precision PCB welding equipment,Pulse heat welding for board assembly

,

High-precision PCB welding equipment

,

Pulse heat welding for board assembly

وزن:
110 كجم
منطقة العمل:
110 مم × 150 مم
تحمل درجة الحرارة:
+ 2 ℃
ضغط هواء العمل:
0.5-0.7mpa
نموذج:
YSPP-1A
مقاس:
500 مم × 750 مم × 910 مم
نطاق درجة الحرارة:
0-400 ℃
الضغط على الوقت:
0-99 ثانية
الضغط على التسامح:
0.05 ميجا باسكال
قوة الترابط:
3900 ن
القدرة على الملعب:
0.25 ملم
المكونات الأساسية:
محرك
التحكم في الضغط:
الرقمية القابلة للبرمجة
التحكم في درجة الحرارة:
معرف PID للحلقة المغلقة
وحدة المحاذاة:
اتفاقية مكافحة التصحر الاختيارية
وزن:
110 كجم
منطقة العمل:
110 مم × 150 مم
تحمل درجة الحرارة:
+ 2 ℃
ضغط هواء العمل:
0.5-0.7mpa
نموذج:
YSPP-1A
مقاس:
500 مم × 750 مم × 910 مم
نطاق درجة الحرارة:
0-400 ℃
الضغط على الوقت:
0-99 ثانية
الضغط على التسامح:
0.05 ميجا باسكال
قوة الترابط:
3900 ن
القدرة على الملعب:
0.25 ملم
المكونات الأساسية:
محرك
التحكم في الضغط:
الرقمية القابلة للبرمجة
التحكم في درجة الحرارة:
معرف PID للحلقة المغلقة
وحدة المحاذاة:
اتفاقية مكافحة التصحر الاختيارية
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for Board Assembly
Pulse-Heated Soldering Machine for FPC to PCB Board
High-precision pulse heat welding equipment for board assembly with advanced thermode technology for reliable FPC to PCB bonding.
Model Specifications: YSPP-1A
  • Accurate tin press without dragging
  • Precise temperature control
  • Fine-pitch positioning capability
  • Digital program pressure control
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 0 Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 1
Advanced Features
  • Rotary table design enables extremely short cycle times with simultaneous loading/unloading during heat sealing
  • High quality heat seal application up to 0.25mm pitch
  • Pneumatic bonding head provides up to 3,900N force
  • Digital programmable pressure control with LCD display
  • Closed loop PID temperature control with visible LED display
  • Real-time pressure sensor triggered bonding cycle
  • Floating Thermode ensures consistent pressure and heat transfer along flexfoil to LCD and/or PCB
  • Precision product fixtures (2X) with easy exchange, micrometer alignment, and vacuum component fixation
  • Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
  • Full microprocessor logic control for reliable operation
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 2 Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 3
Technical Parameters
Parameter Specification
Model YSPP-1A
Size 500mm × 750mm × 910mm
Work Air Pressure 0.5-0.7 MPA
Working Area 110mm × 150mm
Temperature Setup 0-400℃
Tolerance of Temperature +2℃
Time of Pressing 0-99s
Tolerance of Pressing 0.05 MPA
Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 4 Pulse-Heated Soldering Machine for FPC to PCB Board | High-Precision Pulse Heat Welding Equipment for  Board Assembly 5
Technology Overview
Hot bar soldering is extremely effective for bonding dissimilar components and parts that are difficult to unite. This pulse bonding technology differs from traditional soldering by using thermode technology based on rapid reflow through pulse heating. The procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damaging the flex circuit. The system selectively solders parts by heating them to temperatures that melt adhesives or solder, which then re-solidify to form permanent, reliable bonds.